NEC Develops Heat-Conducting Bioplastic for Phones

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Yesterday, NEC Corporation announced that they have developed a corn-based bioplastic that conducts heat faster than stainless steel, and it aims to mass-produce the material starting in April 2008 for use in mobile phones and other portable devices. NEC also said the material could help make laptops and mobile phones thinner and lighter by eliminating the need for heat-releasing sheets or fans.
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The bioplastic is expected to make electronic products more environmentally sound, while solving conventional heat release issues. Apparently, the composite is extremely environmentally friendly as it is mainly composed of biomass-based components including the binder (the biomass ratio exceeds 90 percent, excluding inorganic components such as the carbon fiber).
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NEC Develops Heat-Conducting Bioplastic for Phones
[tags]mobile phone, bioplastic, corn, laptop, conventional heat[/tags]